EINDHOVEN, The Netherlands -- Philips Semiconductors here today announced the creation of an Integrated Discretes operation, which will combine integrated passive components with very small-scale integration (VSSI) devices to serve a broad range of system applications.
"The distinction between ICs and discretes has begun to blur, so it is logical to bring VSSI discretes and discrete semiconductors and multiple passive devices together into a single product line within the same organization," said Stephan zur Verth, general manager of the new Integrated Discretes unit. "This will speed up time-to-market and improve design-in service for our customers."
"Dynamic application areas, such as telecommunications, offer great potential for further growth in integrated discretes," zur Verth said. "Our new organizational structure will ensure that Philips Semiconductors is optimally placed to take advantage of a world market that we expect to grow from $80 million in 1999 to more than $450 million within three years."
The new business unit will focus on integrated discrete solutions for mobile phones, pagers, computers, peripherals, and other applications where board space is limited. The chip arm of Royal Philips Electronics N.V. noted that manufacturing processes for integrated passive components and discrete semiconductors are becoming similar. Thick- and thin-film production techniques have enabled passive component manufacturers to achieve higher levels of integration by combining multiple devices into a single package. Electrostatic discharge protection to complex passive networks have contained semiconductor components, such as silicon diodes, noted Philips.
By bringing integrated passives components into Philips Semiconductors, the Dutch company said it expects to take advantage of the technology overlap and develop devices that are smaller and more integrated.