MOUNTAIN VIEW, Calif. Rambus Inc. said Tuesday (Feb. 29) that Hyundai Microelectronics and Infineon Technologies have joined three other DRAM suppliers is passing component and system-level validation testing of Rambus memory chips and Rambus-in-line memory modules (RIMMs).
According to Rambus, Hyundai and Infineon have joined Samsung, NEC, and Toshiba in volume production of high-bandwidth memories based on the Rambus format. Rambus said the five manufacturers are expected to ship more than 10 million RDRAMs by the end of March.
The available of Rambus DRAMs in high volumes and supporting chip sets from Intel Corp. have been key concerns in the past six months. But Rambus officials are confident that momentum is now building behind the high-speed DRAM architecture.
"Rambus is the technology of choice for new platforms and I am confident that it will deliver a competitive advantage to the market leaders in their quest to differentiate with high performance and innovation," said David Mooring, president of Rambus, based here. "The successful validation of Hyundai and Infineon will help ensure that the overall production volume will continue to increase to meet the growing requirements in the market."