MUNICH -- Infineon Technologies AG here today announced it has begun a 300-mm semiconductor module at its fab in Dresden. Total investments are expected to amount to more than $1 billion over the next three years.
Construction will begin in the immediate vicinity of the existing location. The new 300-mm module will create approximately 1,100 new jobs at Infineon, as well as further jobs at supplier companies in the region, the company said.
The 300-mm project will incorporate manufacturing technology developed in cooperation with Motorola Inc. at the Semiconductor300 joint venture DRAM fab, also in Dresden.
"Through our outstanding leading position in 300-mm technology, we hope to achieve considerable cost savings for Infineon's semiconductor production and expand our competitive edge in the long-term," said Ulrich Schumacher, president and CEO of Infineon Technologies, formerly Siemens Semiconductor. "The plant in Dresden has already proven to be an international reference location in our international fab cluster and will provide the best basis for the efficient production of future chip generations."
Infineon said further details will be announced at the end of May, when official groundbreaking will take place.