PALM BAY, Fla. -- Wireless-chip maker Intersil Corp. here has joined the Corporate Affiliates Program at the University of California, San Diego's Jacobs School of Engineering, and plans to collaborate on wireless research and development as a member of the school's Center for Wireless Communications.
The center, founded in 1995, offers a cross-disciplinary program of research and education targeted at the cellular and wireless communications industry. Intersil recently announced plans to establish a West Coast corporate office and design center in nearby Irvine.
Greg Williams, president and CEO of Intersil, remarked, "Our joint efforts will not only provide potential benefits to Intersil and the Los Angeles-San Diego corridor, but to a global market fueled by growing demand for wireless access to broadband communications content."
"We are always pleased when a leading wireless company such as Intersil partners with us at UCSD," said Robert W. Conn, dean of the Jacobs School of Engineering. "Intersil brings a complementary set of talents and capabilities to the corporate roster of our Wireless Center. We expect Intersil to add great value and to provide an added perspective on major issues of critical importance to the development of circuits and systems on chips for wireless communications and mobility."