NEWPORT BEACH, Calif. -- Conexant Systems Inc. here said today is has reached volume production for its OC-48-speed Internet-backbone IC. The company credits a partnership with Amkor Technology with its ability to ramp up the new product in record time.
"Amkor played a significant role in enabling Conexant's single-chip CX20462 high-isolationcross-point switch to cut the chip-count and power-consumption requirements of high-bandwidth, fiber-optic communications systems by 30% while boosting data throughput to as much as 3-gigabits-per-second," said Joseph Adam, Conexant's executive director of package development.
Amkor contributed a package design that packs 580 connections capable of handling up to 3-Gbit/sec. data rates into less than two square inches. The high-performance ball grid array (HPBGA) package connects the chip's hundreds of OC-48-speed (2.4 Gbit/sec.) input/output (I/O) interconnects to a system board.
Prior to the development of this switching package, the largest cross-point switch IC could handle only much lower density interconnects. Switches using industry standard 2,048-by-2,048 switching matrices with the Conexant chip and Amkor package require fewer than
100 CX20462 ICs to achieve the same functionality of 1,000 of the previous, lower density chips, according to Amkor.
"The CX20462 is the first HPBGA product operating at this speed to ramp to full production and it met all its design objectives on the first pass," said Brian Lynch, Amkor vice president of Advanced BGA products.