SOUTH PORTLAND, Maine -- Fairchild Semiconductor International Corp. here has unveiled a technology initiative designed to meet the power requirements of next-generation microprocessors for high-performance computers.
Over the next few years, microprocessor current requirements are expected to double from current 20-amp requirements while voltage requirements should drop even lower than the present 1.5 and 2.5 volt levels. Fairchild efforts in the areas of silicon and packaging are aimed at these challenges in the space- and power-constrained environments of portable devices, such as notebook computers.
"Fairchild's technology advancements are allowing DC-to-DC converter designers, particularly notebook designers, to meet the challenges of today's power-hungry CPUs," said Jon Klein, Fairchild technical marketing manager.
Innovative new surface mount packages, such as the recently introduced Bottomless SO-8 and BGA, combine miniature packages with the thermal performance of much larger packages while virtually eliminating the package resistance and dramatically increasing the power density. At the same time, improvements in the thermal characteristics of small surface-mount packages have been made possible by Fairchild's integration of the Schottky diode into the low-side MOSFET and Fairchild's optimization of the silicon for low-side operation.
"With our advances in MOSFET silicon technology, the improvement in package technology is of significant use," Klein added. Recent new advancements in PowerTrench silicon technology contribute to improvements in power density and switching efficiency. Power MOSFETs are now optimized for DC/DC applications, reducing or eliminating certain loss components in DC/DC synchronous rectifier buck regulators.
The new trench technology drives specific RDS(ON) to new lows, allowing a lower RDS(ON) device to fit into a smaller surface mount package. The dramatic reduction of the electrical package resistance of these new packages also improves efficiency in both switching power supplies and static switch (on/off) applications.