MUNICH -- ( ChipWire)-- Joining the ranks of chip vendors designing for 10-gigabits-per-second networking, Infineon Technologies this week will release a group of silicon germanium chips for OC-192 systems.
Meanwhile, other vendors continue to build their OC-192 product lines, including Vitesse Semiconductor Corp., which has added another multiplexer/demultiplexer pair to its lineup.
Infineon's chips offer a multiplexer/demultiplexer combination, a transimpedance amplifier and a laser diode driver. All are built on the company's SiGe processes, which run at frequencies of up to 75 GHz, said Holger Hoeltke, product marketing manager for Infineon's high-speed communications ICs.
All the chips can operate at speeds between 9.95 and 10.7 Gbits/sec., allowing enough bandwidth to handle forward error correction.
The FOA41001B1 is a 16:1 multiplexer with an integrated clock multiplication unit. Its companion is the FOA51001B1, a 1:16 demultiplexer with an integrated clock-and-data-recovery (CDR) unit. Both can operate with a 622-Mbits/sec. LVDS interface. The CDR unit is also available as a separate part, the FOA31002A1.
The transimpedance amplifier, the FOA11002A1, is a 5-volt part with an integrated postamplifier. Eliminating the postamplifier allows the part to connect directly to a demultiplexer or CDR unit.
Finally, the FOA21002A1 laser diode driver is a 5-V part with power consumption of 1.7 watts.
Elsewhere, Vitesse's new multiplexer and demultiplexer pair for OC-192 systems, the VSC8173 and 8174, are 3.3-V parts, as opposed to the 5-volt 8171 and 8172 released earlier this year.
The devices are built on Vitesse's 0.25-micron gallium arsenide (GaAs) process. The VSC8173 and 8174 are due to sample in June with production shipments beginning in August.