KUCHING, Malaysia First Silicon (Malaysia) Sdn. Bhd., a silicon foundry startup here, has announced an expanded business relationship with Sharp Corp. of Japan, which has agreed to take delivery of more than $300 million in processed wafers over the next few years.
The companies' expanded business arrangement was struck during two days of meetings, which also marked the official start of Sharp's technology transfer to the foundry's eight-inch wafer fab in Kuching on the island of Borneo, in the Malaysian State of Sarawak. The fab is slated to become operational in the third quarter of this year and will be capable of processing 30,000 eight-inch wafer a month.
Initially, First Silicon's plant will ramp production with Sharp's 0.25-micron logic and mixed-signal CMOS technology. A 0.18-micron process will soon follow.
The Malaysian foundry has exceeded its goals in preparing for the 0.25-micron process, and as a result, Sharp has agreed to expand its business relationship, said Claudio G. Loddo, chief executive officer of First Silicon. The business relationship will now include over $300 million worth of wafer shipments in the next few years as well as support for Sharp's broader product line, Loddo said.