CHANDLER, Ariz.-- Amkor Technology Inc. today announced a partnership with RangeStar Wireless Inc. to provide advanced antenna designs for semiconductor modules used in wireless communications devices.
"We will share our specific individual capabilities -- whether antennas or packaging -- to ensure our customers have the most effective technology solutions for their wireless, RF or other communications products," promised Paul Hoffman, senior vice president of Amkor's Module Business. "This allows, but does not require, customers of both companies to come to one location for design, development, manufacturing and testing of their components for embedded or surface mount communications devices," he added.
Five-year-old RangeStar focuses on high-performance embedded antenna products. "Amkor's System in Package (SiP) technology and RangeStar's embedded antenna expertise allows the entire Bluetooth system to be integrated into a single component," said David McCartney, executive vice president at RangeStar, which is based in Aptos, Calif.
Hoffman said Amkor is rapidly expanding its module expertise with the development of a System in Package prototyping center at its Chandler. The new center will specialize in producing multi-chip modules for wireless,RF, and memory applications.