SANTA ANA, Calif. -- Microsemi Corp. here today announced its first gallium arsenide RF ICs, aimed at IF and RF amplification in wireless and wired voice and data communication products and broadband test equipment.
The two general-purpose heterojunction bipolar transistor (HBT) gain blocks are fabricated in a metal oxide chemical-vapor-deposition-based indium gallium phosphide/gallium arsenide process.
The first products were designed as cascadable 50-ohm, internally matched gain blocks.
The MWS11-GB11-X1 offers DC to 5-GHz bandwidth with 16-dB small signal gain and 19-dBm linear power output at 5 volts. The MWS11-GB12-X1 offers DC to 6 GHz with 17-dBm linear output at 5 V.
Michael Kim, vice president and general manager of Microsemi's Micro WaveSys business unit, said the products have 15% higher power output than published specifications of competing products.
"With this start, we are on schedule to our rollout of a series of RFICs for mobile connectivity applications, which also includes low-noise amplifiers and power amplifiers for second- through third-generation systems implementing CDMA, GSM and W-CDMA with advanced module packaging technology," he said.
These RFIC amplifier chips are initially available in sample quantities in the high-performance ceramic Micro-X package. Pricing information was unavailable.
"We believe this InGaP RFIC chip capability, as well as our roadmap for specialized high-performance RF plastic packages, should enhance our competitiveness in high-performance, ultra-small, cost-effective solutions for mobile phone, wireless infrastructure and wireless LAN applications," said Manuel Lynch, corporate director of marketing and business development.
Microsemi also announced that by this fall, it plans to release itsfirst gain block series in the more competitive SOT-23-5 lead plastic package, plus a new proprietary, high-performance plastic package the company called the Gigamite. The Gigamite package is designed to handle up to 19 dBm and up to 6 GHz. The package will offer lower-cost plastic packaging with competitive performance to ceramic packages.