GENEVA--STMicroelectronics here today announced a low-pass filter chip that it say will enable designers to reduce component count and save space in mobile phone designs.
The EM1F10 is a highly integrated low-pass filter in a flip-chip package that provides the equivalent of 50 discrete components in a chip measuring less than 7-sq. mm, according to the company.
Its latest Integrated Passive and Active Device combines low-pass filtering with electrostatic discharge protection for 10 lines in a device no thicker than 650 microns. This chip-scale package is characterized by bump contacts of 0.5-mm pitch and 0.3-mm diameter. It is fully compatible with the ball-grid-array process assembly and does not require any under-filling when mounted on the board, according to STMicro.
The integrated part also eliminates parasitic impedance, which is caused by multiple contacts between the various components, the company said.