BOISE, Idaho -- In-System Design Inc. (ISD) here announced a partnership NEC Corp. to co-develop a family of ICs, based on a new Universal Serial Bus (USB) 2.0 standard.
Under a partnership agreement, ISD's digital expertise will be combined with NEC's analog capabilities to create what the companies claim will be the world's first single-chip solutions for the USB 2.0 standard.
The companies expect that first silicon chips, housed in 100-pin packages, will be rolled out in November. The devices will be manufactured by NEC.
"We are a known and proven source for our USB 2.0 transceiver," said Jack Wood, USB 2.0 program manager for ISD. "NEC is by far the leader in the analog portion of USB chip design. In addition to our respective design strengths, the fact that OEMs will be able to obtain their USB 2.0 I/O chip from the same foundry that manufactures their host controller or hub chip should resolve potential conflicts."
The partnership comes at a time when a growing number of chip suppliers are preparing new ICs for the high-speed USB 2.0 specification, which is 40 times faster than the existing USB 1.1 spec. During last week's Intel Developer Forum in San Jose, a number of chip suppliers demonstrated their first devices for USB 2.0 applications (see Aug. 22 story).