PHOENIX -- On Semiconductor here today announced a new development effort to create advanced miniaturization techniques with passive integration technology licensed from Advanced Device Design Inc. (ADD) of Tempe, Ariz.
On Semiconductor said it plans to use the technology to develop new manufacturing processes that integrate on-chip passives with high-speed silicon transistors. The potential capability has already demonstrated simulated performance in the 2-to-70 GHz frequency range, according to the company, which was spun out of Motorola Inc. last year as a independent chip supplier.
The overall objective, said On Semiconductor, said is to create a new method for integrating passives on ICs for smaller, lighter, and less costly devices used in communications and broadband systems.
The licensing pact with ADD gives On Semiconductor additional intellectual property and "a significant advantage in the development of techniques that integrate numerous components on a single printed circuit board," said Steve Hanson, president and chief executive officer of the Phoenix company. "The technology market is trying to meet the ever increasing consumer demand for smaller and lighter electronic products and On Semiconductor is determined to deliver solutions that speed the delivery of those products," he added.
With more semiconductor functions being integrated onto ICs, passive components--such as capacitors and resistors--now dominate the component count in electronic products, noted On Semiconductor officials. The company estimated that there are typically about 35 passive components for every integrated circuit inside a system.
On Semiconductor said the licensed technology from ADD could result in the integration of multiple passive components on a small die, reducing the number of external components in system designs. The technology could also speed the development of micropackaging techniques, which will result in lower costs, smaller boards and increased performance.