OTTAWA -- Quake Technologies Inc. here today announced plans to enter the market for optical networking ICs with the development of physical-layer devices for high-speed communications applications. The five-month-old company said it will offer mixed-signal ICs capable of supporting 10-gigabit-per-second and higher-speed networks based on Ethernet, Infininband, Fibre Channel and Sonet/SDH applications.
"The systems currently available are primarily built for telecom applications," said Daniel Trepanier, president and CEO of Quake Technologies. "Our mixed-signal, physical layer chips will enable optical networks to create higher bandwidth for the 10 Gbit/sec. and above optical networking market. Our products will boast high performance with the highest level of integration, and lower power consumption, resulting in lower overall costs," he added.
The fabless semiconductor company has offices in Ottawa and San Jose. To date, Quake has raised $3 million in seed financing, and the company said its next step is to expand its team of engineers, with a focus on high-speed digital ASIC designs.