SUNNYVALE, Calif.--QuickLogic Corp. here announced it has licensed its ViaLink metal-to-metal interconnect technology for field-programmable gate arrays (FPGAs) and embedded standard products to Aeroflex Corp.'s UTMC subsidiary. The Aeroflex unit will use the technology to offer radiation-hardened ICs in space applications.
The licensing agreement will give engineers a new choice for high-speed, low-power and radiation-hardened ICs, said Peter Feist, vice president of worldwide marketing at QuickLogic. "And they will also have the flexibility of using either FPGA or ESP products," he added.
Aerospace engineers have been "clamoring for programmable deep sub-micron design solutions and options, particularly programmable logic with soft and hard IP cores," said Anthony Jordan, director of standard products at Aeroflex UTMC.
Aeroflex bought the UTMC chip business from United Technologies Corp. in 1998 for $46 million (see Nov. 18, 1998, story). The unit (previously called United Technologies Microelectronics Center) supplies semicustom and standard VLSI circuits for defense and space applications.
Terms of the licensing agreement between QuickLogic and Aeroflex were not released.