The National Electronics Manufacturing Initiative consortium launched Thursday its 1998 technical road map efforts, aimed at setting milestones for systems production in the years ahead. The NEMI document is the systems counterpart to the chip technology road map from the Semiconductor Industry Association (SIA).
"We deal with everything above the silicon level," said Jim McElroy, executive director of NEMI, which coordinates its road map with the SIA's work. The two trade groups hold working groups to address chip packaging issues concerning pin counts, new form factors, and heat dissipation.
NEMI, in Herdon, Va., will begin drafting its road map with the convening of its technology working groups in Portland, Ore., on March 19 and 20. The road map will take about nine months to complete and is scheduled to become available to the industry by year's end.