DALLAS -- The first logic devices to use ball-grid-array packaging will appear before the end of the year, it was announced here today. Three chip makers--Texas Instruments Inc., Integrated Device Technology Inc., and Philips Semiconductors--have jointly decided to source several logic devices with the same functionality and pin-outs in low-profile, fine-pitch ball grid array (LFBGA) packaging.
"This is the first time in the logic market that several companies have jointly decided to define packaging, pin-out and functionality," said Ed Agis, TI's worldwide product marketing manager for logic products. "This addresses a real need in the industry."
Space-constrained devices such as wireless telephone systems, base stations, networking systems, memory modules, PCs, and handheld computers are ideal applications for logic devices in LFBGA packages.
"We have utilized the technical strengths and expertise of three leading logic companies to develop a very power- and space-efficient 32-bit logic package," said Tony Walker, IDT's director of marketing for logic products in Santa Clara, Calif. "This new package provides improved circuit integration for board miniaturization and further system integration."
IDT, Philips and TI have defined a LFBGA package with a 0.8-mm ball pitch, 0.5-mm ball size and a nominal height of 1.4 mm which has been approved by JEDEC, JC-11 Committee (MO-205). The 96-ball package takes up just 74.25 sq. mm of board real estate. When compared to existing logicdevices in other types of packages, such as TSSOP (thin shrink small outline package) the new LFBGA package will reduce board space by up to 65% for the same functionality.
The 0.8-mm ball-pitch LFBGA logic package reduces inductance by 45% compared to TSSOP packages, and the small impedance variations between the pins results in a lower skew rate. In thermal-performance tests the LFBGA package was found to be up to 50% more efficient at dissipating heat compared with TSSOP packages.
"In response to our customers' demands for 32-bit applications, Philips Semiconductors' objective has been to provide high-performance products in a package that enables significant
electrical improvements compared to existing package options," said Catherine de Villeneuve, director of marketing for Philips Semiconductors' logic products business line in Eindhoven, The Netherlands.
Samples of the first logic devices from the three companies in BGA packages are expected late in calendar 1998, with poduction volumes to come during the first quarter of 1999.