Electroglas announced it has acquired Techne, a supplier of wafer auditing systems for backend chip assembly operations. Electroglas said the acquisition was made with $6.5 million in cash and stock.
The purchase of Techne expands Electroglas' activities in process and production yield management systems by broadening the Santa Clara, Calif., company's offerings for front-end and back-end semiconductor plants.
"High-volume production and the increase in process steps associated with advanced semiconductor devices have added enormous pressure on chip makers to quickly reach and maintain maximized production yields, which are critical to profitability," said Curt Wozniak, chairman and CEO of Electroglas. "Combining our current yield management offering with Techne's post-fab inspection technologies helps provide our customers with the critical mass to help accelerate their time to profit."
Electroglas said it will take a $2.6 million charge against earnings in the fourth quarter to account for in-process R&D in connection with the acquisition.
In the past year, Electroglas has been aggressively pushing for improvements in linking process and yield management systems between front-end wafer fabs and back-end chip assembly operations. The company has backed efforts to create new standards for chip-level traceability, which would enable manufacturers to record and track process steps for each die.
Wafer auditing systems are used for defect identification, defect classification, measurement, and feedback control processes found in post-fab or back-end applications.
"Our success in developing the technology to inspect completed wafers with microstructures and bumps is an important addition to Electroglas' back-end wafer inspection strategy," said Joe LaChapelle, president of Techne, in Albany, Ore. "We believe this post-fab inspection market segment has exciting potential."