PALM SPRINGS, Calif. -- Six chip makers have joined Intel Corp. and Rambus Inc. to form a Direct Rambus DRAM Implementers Forum to spur use of the new packet memory, it was announced at the Intel Developer's Forum here.
Memory chip firms in the new group include Hyundai Electronics, Infineon Technologies, Micron Technology, NEC, Samsung Electronics, and Toshiba.
The Direct RDRAM Implementers Forum was launched at the Forum on opening day. One goal of the new Rambus group is to spearhead ways to reduce the cost of the new device, which is expected to be launched at a significant premium over PC133 and PC266 SDRAMs. Rambus officials have said a volume ramp for the new memory will occur when costs can be cut to become more competitive with existing SDRAMs.
Richard Malinowski, Intel's director of engineering for the Platform Components Group, said all versions of Direct RDRAM -- 600 to 800-MHz -- are now in volume production at leading memory chip makers. He said the memory chip is on schedule for the expected late-September launch.
He confirmed earlier SBN reports that Intel has designed a transition motherboard switch called Memory Translator Hub (MTH) to ease the shift from current PC100 SDRAMs to Direct RDRAM. He also confirmed that MTH will replace the riser daughterboard, which has been dropped.
In opening sessions today, Intel still had not made its expected announcement on supporting 133-MHz SDRAMs. An Intel spokesman would only comment that an announcement would come at an appropriate time.