SUNNYVALE, Calif.--Flash storage supplier SanDisk Corp. said 8-10% of its wafers in Taiwan foundries had to be scrapped after last week's powerful earthquake.
SanDisk uses UMC Group's United Semiconductor Corp. (USC) and United Silicon Inc. (USIC) wafer fabs to produce 128- and 256-megabit flash devices. SanDisk said the latest information from UMC indicates that the damage to wafers was significantly less than originally estimated.
"We expect shipments of production wafers to resume in the next 2 to 3 days," said Eli Harari, president and CEO of SanDisk. "Assuming that the production interruption at UMC Group is contained to less than two weeks, which now appears to be the case, and that there are no significant power interruptions or major new aftershocks, we expect to be able to use our existing inventory of wafers and die bank to make up for the temporary shortfall of wafers in the fourth quarter," he added.