WILMINGTON, Mass. -- A boron coating and coating process developed by Textron Systems may help reduce impurities encountered in wafer manufacturing, the company said here today.
Developed for use in ion-implantation equipment and components, boron-coated ion source boxes are expected to reduce impurities entering into the process.
The coating process uses a carefully engineered interface between the boron and graphite through a surface-treating step of the graphite. Textron has applied for a patent on the process. This step seals off near-surface porosity, eliminating later void formation in the boron and subsequent debonding. Textron Systems' chemical vapor deposition (CVD) process uses fine tungsten wire for the substrate and boron trichloride gas as the boron source.
"Our boron-coated graphite ion source boxes have the capability to greatly enhance the wafer ion implantation process, including higher process yield, reduced particulate contamination, higher throughput, and longer component life," said Monte Treasure, manager of composite products at Textron Systems, a subsidiary of Textron Inc.