JERUSALEM, Israel -- ShellCase Ltd.'s chip-scale package (CSP) process for CMOS digital image sensors has been implemented in a miniature camera by Photobit Corp., according to ShellCase here. Quality tests conducted by Photobit showed excellent color response, ShellCase said.
The ShellOP package, which ShellCase brought out in January 1999, is designed specifically for CMOS image sensors. The die-sized, ultra-thin package is produced through a proprietary wafer-level process that uses optically clear materials, and completely encases the imager die.
During packaging, the substrate is sandwiched between two thin protective glass plates on the top and bottom sides, while an optically clear epoxy surrounds and protects the edges of the silicon die. Devices are assembled to the printed circuit board using standard SMT methods, and feature a ball-grid array format.
ShellCase said the package helps reduce electronic complexity, lower power requirements, and lower associated costs.
"We have been focused on optimizing the performance of our CMOS digital image sensors and moving applications like cell phone video conferencing to a new level of image quality," said Sabrina Kemeny, CEO of Photobit, headquartered in Pasadena, Calif. "Through our research efforts and utilizing ShellCase's advanced CSP packaging technology we are able to provide a truly superior imaging solution to our current customers, and this technological jump holds great promise for an array of new applications as well."
"Photobit's commitment to imaging excellence is well known in the semiconductor industry," said Shlomo Oren, CEO and managing director of ShellCase, "and we believe the cost and performance advantages of our packaging solutions will further demonstrate that commitment to their customers."