HSINCHU, Taiwan -- Taiwan Semiconductor Manufacturing Co. here today announced it is making available a new logic-based embedded DRAM technology as an option to its quarter-micron foundry process.
Claiming to be the first foundry to offer this capability, TSMC said the embedded DRAM features high performance and a small cell size -- making it ideal for integrating large amounts of memory in system-on-chip (SoC) designs, according to the company.
"The small cell size of logic-based embedded DRAM architecture will allow TSMC to pack significantly more memory into a given chip," said Roger Fisher, senior director of corporate marketing based at TSMC's U.S. office in San Jose. "This is expected to be a key differentiator that appeals to designers implementing next-generation SoC designs."
TSMC's embedded DRAM technology is based on a traditional DRAM architecture, with two additional metal layers for easy integration with other on-chip system blocks. The technology can be delivered as an IP core in various configurations with densities from 1 to 64 megabits with a stacked-capacitor cell size of just 0.78 square micron.
The logic-based embedded DRAM is fully compatible with TSMC's existing 0.25-micron library technology and features electrical performance identical to the 0.25-micron logic process.
Silicon Magic Corp., a manufacturer of DRAM and embedded DRAM solutions for the next-generation information appliance market, is the first customer to use this technology.
"Advanced wafer processing techniques developed by TSMC enable strong system companies, such as Silicon Magic, to build state-of-the-art system-on-a-chip solutions," said Alex Au, president of Silicon Magic, based in Santa Clara, Calif. "We chose TSMC for its strong manufacturing capability and reliable supply lines. Once the designs are in place, our customers can be confident of on-time delivery."
TSMC is accepting tapeouts for the products utilizing embedded DRAM in the 0.25-micron technology now. TSMC's embedded DRAM offering is a part of the company's turnkey technology offering, including process, design service, testing, and customer support.