SINGAPORE -- Foundry chip maker Chartered Semiconductor Manufacturing Limited said Monday (September 1, 2003) that its 130-nanometer manufacturing process technology is in "industry-competitive" volume production and is being used by Broadcom Corp. and Alliance Semiconductor Corp., amongst others.
Silicon Strategies reported that Chartered was in production with 130-nm manufacturing process technology in May 2003 (see May 19 story) and that lead times for the process were lengthening in July (see July 3 story).
Chartered first announced plans for 130-nm process technology in September 2000 saying it would enable customers to go to volume production in the third quarter of 2001, according to this press release available at Chartered's website when this story was first posted.
Chartered said Monday (September 1, 2003) that its all-copper 130-nm process has been in production since the fourth quarter of 2002 and that in terms of process quality, device yields and cycle times the process is now "competitive" with those of other chip makers.
Chartered said it has shipped 10,000 wafers of the 130-nanometer process and that some production devices are yielding more than 90 percent. Cycle times currently range from less than one day per mask layer for prototype devices to less than two days per mask layer for production runs, the company said.
Initial applications included broadband communications semiconductors for Broadcom and SRAMs for Alliance Semiconductor.
"Our strategic relationship with Chartered continues to be an important part of our manufacturing strategy," said Vahid Manian, Broadcom's vice president of manufacturing operations, in a statement. "This collaboration has already produced new networking semiconductor products using Chartered's 0.13-micron technologies, and we currently have multiple devices in production."
The process includes performance- and power-optimized transistors with multiple threshold voltages and SRAM cell options, Chartered said. The company added that qualification of the low-voltage/high-performance transistors is complete and now ready for production. The core logic process also provides a foundation for a suite of plug-in modules for analog, RF CMOS CMOS and SRAM technologies.