SAN JOSE, California -- Research engineers from computer maker Sun Microsystems Inc. are due to report On Tuesday (September 23, 2002) a method of connecting integrated circuits together that could increase the speed of inter-chip communications 100-fold, according to a Reuters report issued late Monday.
In a paper at the Custom Integrated Circuits Conference, senior researchers are due to explain how it is possible to design chips so that they can be placed edge-to-edge, directly touching like carpet tiles, so that data can flow from chip to chip without needing to go through bond-pads and bond-wires
"It's faster, cheaper, and uses less power," Reuters quotes John Gustafson, principal investigator for Sun's high productivity computing systems, as saying.
Sun already holds seven patents on the approach would seek to capitalize on them commercially, the reports quotes an un-named Sun spokesman as saying.
The paper is entitled "Proximity Communication" and authored by Ivan Sutherland, a Sun vice president and research fellow, Robert Drost and Robert Hopkins.
Gustafson said he expected to see the technology in commercial use within five years, according to the report.