ENDICOTT, N.Y. -- Endicott Interconnect Technologies Inc. (EI) has entered into a partnership with the Packaging Research Center (PRC) at the Georgia Institute of Technology to develop and manufacture a new technology called "system-on-package" (SOP).
The SOP concept integrates RF, optical and digital functions into modules or microminiaturized boards. The technology is geared for computing, communications, and consumer applications, according to EI, a spin-off of IBM Corp.
Last year, IBM sold an upstate New York manufacturing division in Endicott to a new company backed by local investors. The new company is called Endicott Interconnect Technologies Inc. and was to receive $100 million of backing from local investors in a state-sponsored deal (see July 2, 2002 story).
The PRC, which focuses on the academic research for electronic packaging, will utilize its 300-mm SOP fabrication facility with a special focus on organic materials. "SOP is to systems as IC's are for transistors," said Rao Tummala, the director of PRC, in a statement. Funding for the PRC is provided by the National Science Foundation and the State of Georgia.
EI is a supplier of organic semiconductor chip packaging, printed circuit boards and assembly services. With over 40 years of experience, EI's product lines support the needs of the IT, telecommunications, test equipment, defense and aerospace, medical, automotive and power management markets.