LONDON -- What's catching the attention of venture capitalists these days? Try wireless, FPGAs, and design-for-manufacturing, as TelASIC, Anadigm, and Sigma-C all announced VC funding last week.
Raytheon spin-off TelASIC Communications Inc., an El Segundo, Calif.-based developer of integrated circuits (ICs) and chipset for wireless communications basestations, said it has raised $35 million Series C funding round. That brings the total venture capital raised by TelASIC to date to $57.5 million, the company said.
The third round was led by Raytheon Company, and saw Agilent Technologies Inc. joining in as a new investor. Existing investors ComVentures, Mission Ventures and Redpoint Ventures, also invested.
Since its spin-off from Raytheon in 2001, TelASIC has introduced three data conversion ICs and the BaseFlex chipset. The funds would be used to continue research and development and to pay for the marketing of TelASIC's products.
Meanwhile, Anadigm Ltd., a developer of field programmable analog circuits with offices in Crewe, England and Campbell, California, has raised $15 million in a third round of funding. The round was led by Atlas Venture with ongoing investment from 3i, Quester and NIF Ventures and the money is intended to fund business growth and further programmable analog IC developments.
Anadigm was founded in January 2000 as a spin-off from Motorola. More than 140 customers are designing Anadigm FPAA technology into their products to provide filtering, signal conditioning, and closed-loop control functions in consumer audio, industrial, and communications systems, the company said.
"Our FPAA solutions continue to gain traction in the marketplace, and customer engagements are validating our technology's value-add. The investment will allow us to implement the next stage of our product strategy and to further penetrate our target markets." said Bill McLean, Anadigm's president and chief executive officer, in a statement.
And finally, Sigma-C, a Munich, Germany-based provider of applied simulation software for the semiconductor industry, has raised $2.87 million in a first round of financing from DVC Deutsche Venture Capital. In conjunction with the financing, Wolfgang Krause, partner at DVC, will join the board of directors of Sigma-C.
This financing round will allow Sigma-C to accelerate
the launch of new design-to-manufacture software products for the semiconductor industry. Leveraging its in-depth technical and market expertise, Sigma-C is developing a line of solutions that more closely link electronic design automation (EDA) software, photomask production and wafer fabrication.