LONDON -- Artimi Ltd., the Cambridge, England, based start-up developing chips for ultrawideband (UWB) applications, has closed a further private investor round. Investors include GEIF Ventures Fund.
Richard Dellabarca, commercial director of the company, would not say how much additional money has been raised. "It is substantial, in excess of $1 million, and will be sufficient to secure our development until the middle of next year. We have also started looking at the next stage of financing, which will include raising resources from venture capital groups and private equity investors."
The money raised now will be used to speed development of its low power UWB transceivers that have multiple interfaces and are capable of delivering data at up to 500-Mbit/s and at distances of up to 30 meters, with precision location capability. Artimi said its solution is based on a patent pending mesh wireless technology.
Dellabarca said silicon should be available by the end of the year, and that the company has already starting demonstrating the benefits of its technology to many consumer electronics companies.
"Our solution will be fully standards compliant, though we do advocate the single mode specification being pushed by companies such as XtremeSpectrum, Motorola and PulseLink. We believe that reflects better the advantages of the technology for consumer applications and has the benefit of quicker time to market."
Dellabarca was referring to the standards debate within the IEEE802.15.3.a working group that is due to decide next month at a meeting in Albuquerque between two competing proposals for the physical layer interface. The XtremeSpectrum/Motorola group, that also includes ParthusCeva and Oki, favors a scheme based on DS-CDMA, while the other group, which earlier this year formed the Multiband OFDM Alliance, advocates a multiband approach and is led by heavyweights such as Intel and Texas Instruments and includes UWB pioneers such as Staccato Communications.
Artimi also announced the appointment of Tom Cooper, an industry veteran, as vice president of sales and marketing. "The opportunities in the UWB chip market are tremendous and Artimi is well positioned to be a leader in this space," stated Cooper.
Cooper was most recently chief executive officer of New Visual Corp., a San Diego California-based fabless semiconductor developer. Prior to this, he was senior vice president of corporate development with GlobespanVirata, where his career spanned the start-up days at Virata, to its flotation on the NASDAQ in 1998 and subsequent merger with Globespan in 2001.
"Tom brings a wealth of sales and marketing experience in the telecommunications semiconductor industry to Artimi," stated Jack Lang, chief executive officer of Artimi, "and he also has the distribution contacts to open new customers' doors for us. Artimi is fortunate to continue to attract such world class talent as Tom to our team." Cooper is based in California where Artimi is setting up its sales and marketing office.