LONDON -- Ericsson Technology Licensing has licensed its Bluetooth core radios KE-1 and KD-1 to Taiwanese semiconductor manufacturer Winbond, joining a long list of companies deploying the Swedish group's Bluetooth technology.
The license agreement enables Winbond to design and manufacture complete Bluetooth products together with a proprietary baseband.
The K-E1 core radio is designed using Taiwan Semiconductor Manufacturing Co.'s 0.18-micron RF-CMOS process, and is said to be one of the most tightly integrated and smallest die-size components available. The K-D1 license package will allow Winbond to differentiate products that specifically target the Bluetooth market segments Winbond is pursuing.
"This deal is important to us because Winbond is a leading company within Asian semiconductor design and manufacturing," Maria Khorsand, president of Ericsson Technology Licensing said in a statement.
She added that the licensing deal would allow Winbond to initially penetrate the Taiwanese market with Bluetooth solutions and later become a key player in Bluetooth adoption worldwide.
Chun-Ming Chang, assistant vice president of Winbond's Network Access Product Center said it chose Ericsson because it "could offer us products that would not only meet the present demands but also those of the future due to their wide expertise in areas such as Bluetooth radio, baseband, software, qualification and interoperability testing."