SINGAPORE--United Test and Assembly Center Ltd. (UTAC) has begun volume 300-mm wafer probe services for UMCi Pte. Ltd., the Singaporean foundry venture of Taiwan's United Microelectronics Corp. (UMC).
Singapore's UTAC, a provider of chip-assembly, packaging, and test services, will start volume probing services for mixed-signal communications devices and digital logic ICs for UMCi.
UTAC has been supporting UMC and UMCi with 300-mm engineering runs and small volume production for than a year.
UMCi, the 300-mm wafer fab that is majority owned by Taiwanese foundry chip supplier UMC, moved to "full-scale production" in March. The move follows the successful fabrication of chips for three customers at the plant. The products include chips for the FPGA and wireless communication sectors, the company said.
UMCi installed its back-end-of-line copper equipment in January of 2003, and shortly afterwards, back-end copper processing of 300-mm wafers signified the start of pilot production. The front-end-of-line equipment installation was completed at the end of 2003.
Back in December 2003 UMC earmarked a $225 million budget for capital expenditure for the fab and in July 2003 UMC planned a cumulative investment in UMCi that would reach $500 million by the end of 2003, with capacity reaching 10,000 300-mm diameter wafer starts per month (see March 3 story).