SAN JOSE, Calif.--eASIC Corp., a provider of structured ASIC products, has secured $5 million in equity financing from Kleiner Perkins Caufield & Byers in its third round of funding.
The chip maker also said Vinod Khosla, a partner in the venture capital firm, is joining eASIC's board of directors.
The new funds will be used to complete the structured ASIC product family and tools set that are being jointly developed with Flextronics Semiconductor and Magma Design Automation. The companies announced the deal last November (see November 24, 2003 story).
The first product member has been taped-out and the product family is scheduled for production release at 0.13-micron process technology in early 2005. In addition, the funding will be used for enhancing sales and marketing, promoting the Structured eASIC product in the U.S. and Japan.
eASIC has taped out of its first structured ASIC array. The company's technology, called Structured eASIC, consists of an array of logic cells (eCells) with SRAM-based look-up table and flip-flops.
eCells are inter-connected by a segmented wiring grid utilizing upper metal layers, which are customized per customer design with a single via-mask. Single via-customization is ideal for an alternative lithography approach, namely the direct-write electron-beam technology.