SAN JOSE, Calif. -- Structured ASIC vendor eASIC Corp. has secured $5 million in equity financing from Kleiner Perkins Caufield & Byers, in a third round of funding, eASIC said Friday (May 28).
The latest tranche of money would be used to complete eASICs product family and software design tools being developed with Flextronics Semiconductor and Magma Design Automation, the company added. In addition Vinod Khosla, a partner at Kleiner Perkins Caufield & Byers, is set to join the eASIC Board of Directors.
The first product member has been taped-out and the full family is scheduled for production release in 0.13-micron manufacturing process technology in early 2005.
"KP is always looking for companies who are strongly positioned to change their respective industry," said Vinod Khosla, Partner at Kleiner Perkins Caufield & Byers. "
"While going through comprehensive due diligence, we recognized eASIC's solid patent portfolio and the viability of its technology, along with the critical industry need for such a solution," said Khosla in a statement issued by eASIC. "eASIC has developed a unique ASIC technology that replaces the disadvantageous programmable interconnect of FPGA's with customized interconnect that provides density and performance close to standard cell, while only using a single custom via layer. Moreover, since via customization is a perfect fit for direct-write eBeam, it allows eASIC to offer maskless lithography and NRE-free ASICs."
"We are extremely pleased to receive our first VC funding from the leading VC firm and to have Vinod Khosla, the most respected venture capitalist, join our board," said Zvi Or-Bach, eASIC president and chief executive officer, in the same statement.