Costa Mesa, CA--May 8, 1996--Irvine Sensors Corp. (Costa Mesa, CA) has entered into an agreement with Cray Research Inc. (Eagan, MN), a subsidiary of Silicon Graphics Inc., (Mountain View, CA) to market various products using a new form of Irvine Sensors' proprietary chip-stacking technology.
The new form, referred to as a "Memory Mini-Cube," was developedby Irvine Sensors to Cray's specifications for use in very high-performance memory systems of computers and avionics. IrvineSensors has delivered initial engineering units of the new MemoryMini-Cube which Cray has successfully tested.
The Memory Mini-Cube is a three-dimensional stack of up to eightsemiconductor chips. Containing up to eight memory chips, it isdesigned to be mounted on the edge of the stacked chips. Edge-mounting permits a smaller "footprint" and denser electricalconnections than single chips, thereby increasing the achievabledensity of boards and packages that can accommodate the resultingheight.
Irvine Sensors Corp.
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