Fremont, CA--June 17, 1996--A high-density oxide-etch system has been announced by Lam ResearchCorp. (Fremont, CA). The system, called the Transformer-Coupled Plasma 9100system, is designed to meet the full spectrum of requirements inoxide-etch processing and manufacturing for the most advancedmicroprocessor and memory devices. It is the industry's firsttool that combines high throughput with high etch rates andadvanced process performance, while etching devices in the deepsubmicron regime, with minimum feature sizes of less than 0.35micron. Oxide etching is reported to account for 45 percent of the etch market.
Chipmakers have been seeking an oxide-etch method that can meettheir dual requirements for 0.25-micron processing capabilityand consistent production performance. The TCP 9100 responds tothis need.
The TCP 9100 system is a multichamber cluster tool on Lam'sAdvanced Capability Alliance platform. Capable of supporting upto four process chambers, the radial cluster configurationreduces cost of ownership in high-volume manufacturing byincreasing throughput, maximizing capital investment, andoffering capability for future expansion.
Lam Research Corp.
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