Santa Clara, CA--July 22, 1996--High Level Design Systems Inc. (Santa Clara, CA) and OEA International Inc. (Santa Clara, CA) announced an original equipment manufacturer agreement. The agreement combines OEA's 2D field solver technology with HLDS' deep submicron RC-extraction tool, called HyperExtract.
Under the terms of the agreement, HLDS will integrate and distribute OEA's core METAL 2D capacitance field solver through its worldwide direct sales channel. The field solver technology will be integrated with HLDS' HyperExtract deep submicron RC-extraction system. The companies estimate that using the combined tools will reduce the time spent by process engineers to simulate and write rules for extractors.
In the full OEA product offering, the METAL interconnect-simulator package is used to understand, analyze and optimize interconnect delay and crosstalk, and their effects in IC, PCB, hybrid, multichip module, and package modeling applications. METAL includes a range of Laplace/Poisson field solvers to calculate capacitance, resistance and inductance matrices of interconnect structures including buses, vias, crossovers, and IC cell parasitics. A fully-3D graphical viewer displays the input structures and also contour, perspective, or field mapping plots of variables in the solutions. METAL generates matrix output and fully-coupled RCLK Spice sub-circuit decks for the defined structures.
High Level Design Systems Inc.
3945 Freedom Circle, Fourth Floor
Santa Clara, CA 95054
Fax (408) 748-3499
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