San Jose, CA--November 19, 1996--OnTrak Systems Inc. (San Jose, CA) unveiled SYNERGY, a CMP tool that performs mechanical brush scrubbing and in-situ chemical etching simultaneously in a single system. This one-step cleaning approach enables SYNERGY to deliver throughput of 55+ wafers per hour for a number of critical CMP cleaning applications, including interlevel and intermetal dielectric, tungsten, and shallow trench isolation.
SYNERGY delivers chemicals such as HF and ammonium hydroxide directly to the brush box and features through-the-brush chemical delivery to the wafer surface, which ensures more even chemical distribution and contributes to higher throughput.
Brush pressure is programmable and available in an increased range, offering greater process flexibility and therefore, enhanced cleaning capability. Complete isolation of the brush box stations enables chipmakers to run different chemical processes simultaneously. SYNERGY is capable of processing six-inch and eight-inch wafers with a footprint equal to that of its predecessor, the DSS-200 Series II.
1010 Rincon Circle
San Jose, CA 95131
Fax: (408) 952-5441
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