Northbrook, IL--November 14, 1996--The Institute for Interconnecting and Packaging Electronic Circuits (IPC; Northbrook, IL) is producing the IPC Printed Circuits Expo '97 and 40th Annual Meeting, taking place Mar. 9-13, 1997 at the San Jose Convention Center (San Jose, CA).
In addition to more than 35 workshops and tutorials already scheduled, IPC Printed Circuits Expo will present a technical conference addressing the latest developments in design, fabrication, and assembly of printed circuit boards.
Some of the educational forums and papers highlighting this year's conference include the NEMI Roadmap Panel on the future requirements for PWBs, a point/counterpoint panel on the R&D disconnect--OEMs vs. fabricators, and a session on the impact of wafer level chipscale packaging on the PWB.
2215 Sanders Rd.
Northbrook, IL 60062
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