San Jose, CA--May 27, 1997--Atmel Corp. (San Jose, CA) announced that it is now offering a plastic package for its line of SPLD programmable logic devices that is more than 70 percent smaller than the standard package usually available for such devices.
The TSSOP (thin, shrink, small outline package) configuration is now available for Atmel's complete line of programmable logic devices including the ATF16V8 series, the ATF20V8 group, and the company's family of ATF22V10 circuits.
This new package has a footprint for a 20-pin circuit that is 71 percent smaller than for the same device in a PLCC (plastic J-leaded chip carrier) package and 78-percent smaller for a 28-pin device. The new package is 80 percent thinner for either pin count.
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