Santa Clara, Calif.--June 24, 1997--Electroglas Inc. (Santa Clara, Calif.) introduced its new high-load Hinged Testhead Manipulator (HTM)--capable of supporting the largest testheads currently available (up to 1,500 pounds).
The new HTM is offered as a fully-integrated option for Electroglas' Horizon Series wafer probers, including its flagship Horizon 4090.
Working closely with leading automatic test equipment (ATE) manufacturers, Electroglas developed the new HTM to support the large testhead weights associated with testing increasingly dense, next-generation IC applications. The new HTM offers a cost-effective solution for accurate and repeatable docking of large testheads to Electroglas wafer probers.
The new Electroglas HTM will guarantee docking alignment repeatability for a minimum of 3,000 cycles (one cycle equals one full dock and undock of the testhead). Ergonomically designed and fully integrated on the left side of the prober, the new HTM's footprint is significantly reduced compared to a stand-alone manipulator, minimizing requirements for valuable floor space. It also meets Class 1,000 cleanroom standards and SEMI S8 and Electromagnetic Compatibility Certification/Communite Europe (EMC/CE) safety and ergonomic compliance requirements.
Fully supporting the testhead cable harness through the full 180 degrees, the new HTM is completely motor driven and controlled. In addition, the new HTM features an interlock function that automatically disables the manipulator drive when the HTM is in the docked and latched position, further enhancing safety and test integrity.
The new HTM will be offered as a fully integrated option or retrofit on all Horizon 4060X, 4080X, and 4090 wafer probers. HTM production units will be available in the third quarter of 1997.
Santa Clara, CA
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