Santa Clara, Calif.--June 23, 1997--Applied Materials Inc. (Santa Clara, Calif.) is ramping up its 300-mm program, scheduling shipments of 300mm epitaxial deposition (epi) systems to major silicon wafer manufacturers in Japan, Europe, and the U.S. The company expects to ship more than five 300-mm epi systems to customers starting as early as July 1997.
These systems are expected to be used by the wafer suppliers for 300-mm epi development and pilot line production. Chipmakers can then use these wafers for the development of next-generation high-speed devices that are being planned for tomorrow's 300-mm manufacturing lines.
These epi systems are the second 300-mm product that Applied Materials has begun shipping to customers. Earlier this year, the company announced shipment of a 300-mm rapid thermal processing (RTP) system. Applied Materials is developing a full range of technically advanced systems across its entire line of more than two dozen process technologies to provide its customers with a total solution for their 300-mm processing requirements. Several of these 300-mm products are currently undergoing testing at customer sites.
Santa Clara, CA
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