San Jose, Calif., July 29, 1997 (Business Wire)---Silicon Valley Research (SVR) today announced the release of SonIC-V3.0 for immediate shipment.
SonIC is an automatic place and route tool targeted specifically for the design of large, high-speed cell-based Ics using area routing technology. SonIC features a unique architectural approach that combines true gridless cell-based placement with SVR's LineSearch area routing technology. SonIC Version 3.0 includes the super-fast new TeraCell placer and a new automatic Power Router.
Building on extensive experience in the microprocessor design market, SonIC's unique architectural approach gives advantages in die size, tur-around time and timing control. SonIC's TeraCell placer from CLK Computer-Aided Design Inc. is the industry's fastest cell placer, completing 300,000 cells in 106 minutes.
SonIC is priced by design capacity with U.S. prices ranging from $180,000 to $400,000. SonIC-V3.0 is available immediately on HP and Sun MicroSystems UNIX platforms.
Silicon Valley Research Inc.
Tony Kasovich 408-361-1046 (0330 fax)
6360 San Ignacio Avenue
San Jose, CA 95119
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