Santa Clara, Calif.--Aug. 20, 1997--Applied Materials Inc. (Santa Clara, Calif.) is completing plans for their equipment development pilot line at its headquarters. This new facility will enhance the company's engineering and technology activities to a new level by enabling integrated development, test, and demonstration capabilities for its extensive process technologies.
The pilot line project is part of a $430 million investment in the company's Santa Clara facilities to support system and process development for both 200 mm and 300 mm wafer sizes.
The pilot line will have a full range of process technologies, including lithography and wet processing, that will enable Applied Materials to perform complete wafer processing cycles similar to those used in its customers' semiconductor fabs. For its lithography needs, Applied Materials has selected an ASM Lithography's (ASML) deep UV stepper, which will be delivered by the end of 1997. The ASML system will be configured initially for 200 mm wafers, and is designed to be upgraded for 300 mm process development. The pilot line will also include a metrology laboratory with a full range of material and electrical testing tools for measuring process and device performance.
Santa Clara, CA
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