San Jose--Aug. 20, 1997--AG Associates (San Jose) announced it has received an order for its 300 mm RTP system.
The 300 mm RTP system, which is based on the company's recently introduced Starfire 200 mm RTP system for 0.18-m applications, will be used for evaluation in Semiconductor Leading Edge Technologies Inc.'s (SELETE's) 300 mm equipment program in Yokohama, Japan.
The 300 mm RTP system is slated to be shipped to SELETE's R&D facility in Yokohama during the first quarter of 1998. Using Starfire's successful 200 mm technology, the 300 mm RTP system will enable chipmakers to achieve the required temperature uniformity and repeatability for 0.18-m processes with high throughput rates at a low cost of ownership.
In addition, the extendibility of the 200 mm Starfire system for 300 mm production allows AG Associates to reduce the time and cost associated with the development of the new 300 mm RTP tool.
Key to AG Associates' 300 mm RTP development effort, the company entered into a Cooperative Research and Development Agreement (CRADA) with Sandia National Laboratories (Livermore, Calif.) in February of this year. Under the terms of that agreement, AG Associates and Sandia have been working closely together to accelerate the development and optimization of AG Associates' 300 mm RTP system.
The CRADA is providing AG Associates with computer-simulated data on its RTP design concepts. Using Sandia's computational models and numerical simulations, AG Associates' design issues and questions can be resolved without traditional trial-and-error prototype experiments.
San Jose, CA
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