Sunnyvale, Calif.--October 27, 1997--Version 4.0 of Medici, asemiconductor device simulator used to predict electricalcharacteristics of 2-D structures, is now available from TechnologyModeling Associates, Inc. Significant enhancements inthe areas of advanced meshing of simulation structures, modeling ofpower devices, simulation of compound semiconductor materials, and ACsmall signal analysis have been included in version 4.0 of Medici.
The automatic boundary conforming (ABC) meshing capability, firstavailable in previous releases of Medici, helps users to generatesimulation mesh for various types of device structures. This capabilityis particularly well suited for creating meshes for highly non-planarstructures generated by process simulators, since it creates meshesin which grid lines conform to boundaries and interfaces.With Medici 4.0, grid lines also conform to junctions, which isimportant for accurate simulation of breakdown phenomena andbipolar current-gain.
The ABC mesh capabilities in Medici 4.0 include additional gridspacing control features and automatic grid optimization for generatingbetter meshes for device simulation.
The modeling of power devices has also been improved in Medici 4.0. Theprogram now includes models for lattice temperature-dependent electronand hole lifetime. This feature is particularly useful for modeling theeffects of carrier lifetime due to changes in lattice temperature indevices such as IGBTs, GTOs, and LDMOS structures.
In the area of heterojunction device modeling, newmole-fraction-dependent models have been added for energy bandgap,electron affinity, carrier effective mass, conduction and valence banddensity of states, and carrier mobility. These additions improve the modeling capabilityof devices built with compound semiconductor materials such as AlGaAs,InGaAs, AlInAs, GaAsP, InGaP, and InAsP.
Interconnect parasitic effects play a significant role in theperformance of advanced semiconductor devices. AC small-signal analysiscan now be used when simulating structures that include lump elements(R, C, I) or contact resistance. Medici 4.0 can also allow currentboundary conditions to be applied during AC small-signal analysis.
Other miscellaneous enhancements in Medici 4.0 include dynamic errortolerance for transient simulation to maximize simulation accuracy andminimize CPU time, and improvements in the continuation method for morerobust simulation of complex phenomena such as latchup and electricaland thermal breakdown.
Medici is available now on UNIX-based workstations from DigitalEquipment Corp., Hewlett-Packard, IBM, and Sun Microsystems.
Return to Headlines