Garden Grove, Calif.-- Oct. 23, 1997--Dense-PacMicrosystems Inc. has filed an application to patentits new innovative process of stacking ball grid array("BGA") based memories.
To protect its intellectual properties, the company shallcontinue to pursue patents on its processes and technologies.Simultaneously, as an integral part of their strategic plan,Dense-Pac expects to create new business opportunities through thelicensing of these patents.
According to an article in EDN Products Edition (August 1997),although BGAs are not new, they are only recently reachingsignificant volumes in the merchant market and will increase involume over the next several years. That class of package can be asolution for many users who need a smaller and more functionalelectronic packaging.
The Ball Grid Array packaging process utilizes solder ballswhich enables the computer manufacturer to mount a semiconductorcomponent die directly onto a circuit board allowing for a very lowprofile. These low-profile dimensional features have made BGAsespecially attractive to designers of portable computers who areconstantly driven to provide the highest power in the smallest andlightest packages. The inherent low cost of BGAs has contributed totheir popularity.
This represents one of several new patents that Dense-Pac hasrecently secured or is in the process of submitting on itsproprietary high density memory and related technologies.
Dense-Pac's design engineers are continuing to provide productswith increased capabilities in smaller packages. The BGA takesadvantage of the previously unused under-chip real estate,increasing both the number of inputs/outputs and the pitch,eliminating perimeter leads and reducing the handling problemsassociated with high pin-count devices. Current manufacturingmethods and equipment can be employed, ensuring yields consistentwith current standards.
Dense-Pac Microsystems Inc.
William M. Stowell
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