San Jose, Calif--Oct. 22, 1997--GaSonics International has shipped its L3510 photoresist removal system to Flip Chip Technologies (Phoenix, Ariz.).
The system will be used for the Flip-Chip Technologies L.L.C. "redistribution process" -- a new application and market for GaSonics. Flip-chip interconnect technology is increasingly replacing traditional wire bonding due to its inherent performance and productivity advantages. This next-generation technology entails inverting the chip at first-level packaging by means of solder bumps,which both mount and connect the chip to the single- or multi-chip module.
The elimination of wire bonds makes the entire substrate surface available for I/O interconnections, resulting in greater density inless space.
TechSearch International, an Austin-based industry market research and consulting firm, predicts that flip-chip production for inside packages and bare die on boards will expand rapidly over the next seven years.
GaSonics reports that its experience, as evidenced by the company's market leadership and its large installed base of L3510 systems, was a key factor in Flip Chip Technologies' purchasing decision. The technical capabilities of the L3510, including its proven downstream technology, reliability, and high throughput were also considerations.
The L3510 is a versatile, downstream microwave plasma-based system designed primarily for clean, damage-free removal of the most difficult resist structures. Utilizing the proven L-series platform,the L3510 has a wide process window due to its patented large-diameter source.
Programmable process parameters, as well as the ability to perform both platen and lamp heating, contribute to the system's process flexibility. The L3510 is capable of running 100-mm to 200-mm wafers.
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