Santa Clara, Calif.--Nov. 20, 1997--Taiwan Semiconductor Manufacturing Co. (TSMC) is continuing to expand semiconductor production at its facilities in Hsinchu, Taiwan, by placing an order worth $96 million for advanced chipmaking technologyfrom Applied Materials Inc. (Santa Clara). This new TSMC order was booked in the fourth quarter of Applied Materials' fiscal 1997; the systems are expected to be shipped in the spring of 1998. This order, combined with two earlier purchases from the company this year, result in combined TSMC-related purchases of $413 million for fiscal 1997.
Equipment ordered by TSMC will be installed in Fabs 3, 4, and 5 inHsinchu, which are adding capacity for 1998. The Applied Materials' systems will be used to ramp up TSMC's production of 0.35-m DRAMand logic devices, as well as for pilot production of 0.25-m-generation devices.
TSMC's order involves multiple units of Applied Materials' advanced chipmaking technologies:
- Endura physical vapor deposition (PVD) systems for aluminumand barrier metal deposition
- DPS (decoupled plasma source) and MxP-series systems for oxide, metal, silicon etching
- DxZ Centura systems for dielectric chemical vapor deposition (CVD)
- WxZ Centura systems for blanket tungsten CVD
- Mirra CMP systems for chemical mechanical polishing
To support Applied Materials' expanding business in Taiwan, the company has recently completed an 81,000 square foot Technology Center in Hsinchu, which contains facilities for advanced process development and demonstration, component design and manufacturing of spare parts.
Santa Clara, CA
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