San Jose, Calif.--Dec. 22, 1997--Flextronics International Ltd., a global full-service supplier of innovative design and engineering and manufacturing solutions,is launching a worldwide network of Product Introduction Centers (PICs).
The PIC sites will provide localized PCB layout, product design anddevelopment, advanced interconnect technology support, design formanufacturing and test, along with electrical simulation, thermal andmechanical modeling, and quick-turn prototype production services.
Local PICs will be staffed by Flextronics engineers experienced in workingwith customer engineering teams on a variety of preproduction issues,including design for low cost, tooling expertise, and the use of advancedtechnology to meet specific product requirements.
The first five sites, located in San Jose, Calif; Westford, Mass; Karlskronaand Stockholm, Sweden; and Althofen, Austria are now open. Flextronics plansto open additional PIC sites in the coming year in Southern California and theSouthwest. Other regions targeted for PICs include the Midwest and RockyMountain areas, with several planned in major cities throughout Europe in thesame period.
Flextronics' PICs are part of the corporation's complete spectrum ofengineering services. PICs enable customers to take advantage of productintroduction and engineering support in locations geographically distant fromone of Flextronics' ten worldwide manufacturing operations. Flextronics willalso help the customer transfer volume manufacturing of new products to themost appropriate company manufacturing site. This strategy is designed tohelp both large and small OEMs compete more efficiently in the global market.
Flextronics' Product Introduction Centers offer a seamless transition fromdesign to volume production launch by coordinating services between thecustomer, Flextronics, and any third-party suppliers. This centralizedfunctionality reduces product development and introduction cycles, whileoffering application-specific technology choices to meet cost, performance, orsize reduction targets.
Flextronics Engineering Services are organized to support digital andanalog/RF design, PCB layout, prototypes, and preproduction, as well as testdevelopment and qualification. The group oversees advanced SMT manufacturingprocess development and implementation tasks, including Ball-grid array (BGA),micro BGA, chip-scale packaging (CSP), chip-on-board (COB), and Flip Chip processcharacterization and qualification. In addition, the group is responsible forbare die assembly production in the U.S., including prototype and volumeproduction of COB and multichip module (MCM) assembly, as well as prototypeFlip Chip and mixed SMT/COB assembly.
Flextronics' engineering and manufacturing services were developedspecifically to attract blue-chip customers. By expanding sites and campusesto three continents, Flextronics has streamlined regional manufacturing anddistribution processes and reduced logistical barriers to manufacturing. Thisprovides customers with important advantages, including the removal ofimport-export restrictions on raw materials.
Since the beginning of 1995, Flextronics has more than tripled itsmanufacturing space (to approximately 2,000,000 square feet). Thirteenlocations worldwide include San Jose, Calif. (campus); Westford (Boston), Mass.;Guadalajara, Mexico (campus); Karlskrona, Sweden (campus); Althofen, Austria;Sarvar, Tab, and Zalaegerszeg, Hungary; Tonypandy, Wales; Malaysia; Singapore;Doumen (campus) and Xixiang, China.
Corporate Marketing Manager
Return to Headlines