Fremont, Calif.--Dec. 29, 1997--Mattson Technology CEO Brad Mattsonwill participate in a panel discussion on the opening day of SEMI'sIndustry Strategy Symposium, one of industry's foremost gatheringsof senior executives and analysts in the semiconductor and semiconductorcapital equipment industries.
Mattson will be addressing the topic of "The 300-mm Dilemma--What's Changed?" with other panelists from Intel, Texas Instruments, andSamsung. Dan Kleskin of Bancamerica Robertson Stephens will moderate the discussion. This program is designed to provide a forumfor suppliers and device manufactures to discuss business trends and roadblocks in preparation for the transition to 300-mm wafers.
The move to 300-mm wafers is one of the largest industrial transitions in history and carries a price tag of upwards of $14billion. Processing on 300-mm wafers is expected to significantly improve the cost efficiency of making integrated circuits. In spite of extensive ramp up costs, 300-mm wafers can yield more than twice the number of devices currently being manufactured on 200-mm wafers, thereby making it possible to lower the per-device cost to manufacturers.
The conference, which will address a number of issues of vital interest to the semiconductor industry, takes place from Sunday, Jan. 4 through Wednesday, Jan. 7. For more information contact Lindsey Mitobe of Mattson Technology at (510) 492-6334.
3550 W. Warren Avenue
Fremont, CA 94538
Fax (510) 657-0165
Return to Headlines