Kanata, Ont.-- March 23, 1998--Tundra SemiconductorCorp. announced volume shipment of the Universe II, theindustry-leading VME-to-PCI bus bridging chip. The Universe II includesincreased functionality in the form of additional programming resources,greater data transfer rates, and lower power consumption, while maintainingfull Universe backwards compatibility.
VME is increasingly the system backbone of choice in a variety of real-timeand message-oriented architectures. The Universe family supports thesesystems through high performance and a flexible, interruptstructure. The Universe II chip significantly improves on this through theaddition of mailboxes, location monitors, and seven new software-initiatedinterrupts. Telecommunications applications are expected to especiallybenefit through the power these features bring to VME. In addition,Universe II supports eight semaphores for simultaneous sharing of resourcesbetween system processes to better support multiprocessing applications.
Bus parking, improved arbitration mechanisms, lower overhead on linked list DMAtransfers, and longer PCI transactions ensure the bus bridge does notbecome the limiting factor in system performance. In addition, deep FIFO'sprovide maximum bandwidth on both buses, even when operating with high-latency targets. In addition, thanks to a migration to a smaller geometry,Universe II users can expect a 20 percent power reduction from that of Universe.
Leading customers currently using the Universe include Motorola ComputerGroup, Force Computers, DY4 Systems, Themis Computer, Heurikon, andPerformance Technologies.
To support rugged and military applications, the Universe II chip isavailable now in industrial (-40 to 70 degrees C) and extended (-55 to 125degrees C) temperature options in a plastic 313-pin BGA package. TheUniverse II is priced at parity to the Universe chip, $160 each based onpurchase of 1,000 pieces.
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